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NB MEMORY 4GB PC12800 DDR3/SO KVR16S11S8/4 KINGSTON

Cod ELKO
1162621
Kingston Technology ValueRAM . Component for: Laptop, Internal memory: 4 GB, Memory layout (modules x size): 1 x 4 GB, Internal memory type: DDR3, Memory form factor: 204-pin SO-DIMM, CAS latency: 11
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SPECIFICAȚII
Features
Internal memory type
DDR3
Internal memory
4 GB
Buffered memory type
Unregistered (unbuffered)
CAS latency
11
Memory voltage
1.5 V
Memory form factor
204-pin SO-DIMM
Memory data transfer rate
1600 MT/s
Component for
Laptop
Memory layout (modules x size)
1 x 4 GB
ECC
No
Memory bus
64 bit
Memory ranking
1
Module configuration
512M x 64
Row cycle time
48.125 ns
Refresh row cycle time
260 ns
Row active time
35 ns
Country of origin
Taiwan
Lead plating
Gold
Operational conditions
Operating temperature (T-T)
0 - 85 °C
Storage temperature (T-T)
-55 - 100 °C
Weight & dimensions
Width
67.6 mm
Height
30 mm
Package type
SO-DIMM
Harmonized System (HS) code
84733020
Other features
Chips organisation
X8
Bus clock rate
1600 MHz
Error indication
No
Internal memory
4096 MB
Memory layout
1 x 4096 MB

Kingston Technology is the world's independent memory leader and is well-known for providing high quality memory products at an attractive price. Kingston ValueRAM is your best source for industry-standard memory to maximise the performance and productivity of your system. Built with A-grade components only, Kingston ValueRAM memory modules come with a lifetime warranty.

  • JEDEC 1.5V Power Supply
  • VDDQ = 1.5V
  • 800MHz fCK for 1600Mb/sec/pin
  • 8 independent internal banks
  • Programmable CAS latency: 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS)
  • Bi-directional Differential Data Strobe
  • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°Cº
  • Asynchronous Reset
  • PCB: Height 1.180” (30.00mm), double sided component

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