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CPUX6C 1700/8.25M S3647 BX/BRONZE 3104 BX806733104 IN

Cod ELKO
1218698
Intel Xeon 3104. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Processor package size: 76mm x 56.5mm. Maximum internal memory: 768 GB, Maximum internal memory: 786432 MB
SPECIFICAȚII
Processor
Processor manufacturer
Intel
Processor generation
1st Generation Intel® Xeon® Scalable
Processor model
3104
Processor base frequency
1.7 GHz
Processor family
Intel® Xeon®
Processor cores
6
Processor socket
LGA 3647 (Socket P)
Component for
Server/workstation
Processor lithography
14 nm
Processor threads
6
Processor operating modes
64-bit
Processor cache
8.25 MB
Processor cache type
L3
Thermal Design Power (TDP)
85 W
Package type
Box
Cooler included
Yes
Stepping
U0
Processor codename
Skylake
Processor code
SR3GM
Processor ARK ID
123546
Memory
Maximum internal memory supported by processor
768 GB
Memory types supported by processor
DDR4-SDRAM
Memory clock speeds supported by processor
2133 MHz
Memory channels
Hexa-channel
ECC
Yes
On-board graphics card
No
Features
Execute Disable Bit
Yes
Market segment
Server
Maximum number of PCI Express lanes
48
PCI Express slots version
3.0
Supported instruction sets
AVX/AVX 2.0/AVX-512/SSE4.2
Embedded options available
No
PCI Express CEM revision
3.0
Scalability
2S
Export Control Classification Number (ECCN)
5A992C
Commodity Classification Automated Tracking System (CCATS)
G077159
Processor special features
Enhanced Intel SpeedStep Technology
Yes
Intel Trusted Execution Technology
Yes
Intel® AES New Instructions (Intel® AES-NI)
Yes
Intel® Hyper Threading Technology (Intel® HT Technology)
No
Intel® Speed Shift Technology
Yes
Intel® Turbo Boost Technology
No
Intel® Transactional Synchronization Extensions
Yes
AVX-512 Fused Multiply-Add (FMA) units
1
Conflict-Free processor
Yes
Intel 64
Yes
Intel TSX-NI
Yes
Intel TSX-NI version
1.00
Intel Turbo Boost Max Technology 3.0
No
Intel Virtualization Technology (VT-x)
Yes
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel® Optane™ Memory Ready
No
Intel® Volume Management Device (VMD)
Yes
Intel® vPro™ Platform Eligibility
Yes
Mode-based Execute Control (MBE)
Yes
Tcase
78 °C
Technical details
Intel® Speed Shift Technology version
1.00
Intel® Volume Management Device (VMD) version
1.00
Last change
63903513
Launch date
Q3'17
Maximum memory
768 GB
Memory speed (max)
2133 MHz
Mode-based Execute Control (MBE) version
1.00
Number of UPI links
2
Processor brand name
Intel Xeon Bronze Intel Xeon Bronze Processor
Processor cache
8448 KB
Product family
Intel Xeon Processors
Product type
Processor
Status
Launched
Supported memory types
DDR4-SDRAM
Harmonized System (HS) code
85423119
Processor package size
76mm x 56.5mm mm
Other features
Maximum internal memory
768 GB
Maximum internal memory
786432 MB
CPU Family name
Intel Xeon Bronze
Model number
3104

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

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